Home > Products > Gamma 1000c

The Gamma 1000c thin film sputtering tool

Introduction

Gamma 1000C is a state-of-the-art sputtering tool, highly-optimised for both performance and versatility of use.  It is capable of depositing conducting and insulating layers of materials in sequence or simultaneously - with unmatched film uniformity - and is ideal for users seeking the optimum quality. Featuring a hydrocarbon and particle free vacuum pumping system, a processing chamber with fast-access entry, and a graphical HMI offering both fine manual control and recipe-driven operation, Gamma 1000C is the ideal platform for R&D and pilot production. 

Pumping

The Gamma 1000C's main process pump is a world-class, APD 8LP Marathon cryo-pump for pressures to 10–9 Torr, and an Alcatel roots dry pump for primary pumping to crossover pressures. This pumping combination delivers an extremely clean vacuum, with no hydrocarbon back-streaming or contamination of deposited film. The Alcatel dry pump is unlike all others on the market today. The roots assembly features non-contact compression stages, which minimizes particle generation and carry-over to the chamber, with the added benefit of low maintenance periods (~22,000 hours on clean PVD processes in most cases).

Process chamber  

Access to all parts of the process chamber and magnetrons (up to 6) is exceptionally easy due to the tool's novel fast-access entry. Pneumatically operated, and allowing access at the touch of a button, this feature simplifies R&D operations where targets and stages need to be changed quickly and frequently. Once opened, all internal chamber components are accessible and may be removed for cleaning within a few minutes.

HMI

Processing capability is completely programmable, providing optimum flexibility of use. User-friendly software - a version of Surrey NanoSystems' field-proven SCADA (supervisory control and data acquisition) package - gives fine control over all stages of processing via graphical MIMIC-style displays. Surrey NanoSystems includes generic sputtering recipes with the tool, providing ready-to-use deposition processes. Users also have complete manual control, and are be able to adapt these recipes, or create their own custom processes using a menu-driven user interface to control gas flow rates, voltage and current levels, RF power, temperatures, etc.  Sophisticated data-logging, trending and batch tracking facilities help users to develop and document their own processes, to optimise recipes for commercial production.  Remote monitoring is also possible. 

Modular architecture

The Gamma 1000C's architecture is modular, allowing complete flexibility of confguration - and can be configured as a simple thin film deposition system or as a highly automated turnkey unit with features such as annealing, load lock, wafter preparation, wafer analysis, etc.  Provision of spare interfaces and facilities are considered with every system build, and the underlying electrical and pneumatic architecture is fieldbus based, providing users with an expandable tool that may be easily upgraded as requirements change, or budgets become available.

Gamma 1000C basic specification

4 Targets (standard 2 for magnetic materials) with fast-change magnet packs (changing magnetron field strength takes no longer than a target change)

Sputter Down so no target re-contamination by falling film particles that are then re-sputtered as an alloy contaminant in high purity materials

Co-deposition with wafer rotation for alloy sputtering used in special alloy and material creation

Very low cost of ownership over tool life tool service requirements and spares holding is limited and designed to last 5-8 years between major service periods, with minor service needs yearly

Turbo pumped HV load lock with automatic wafer transfer gives fast transfer to sputter chamber with minimal contamination. No skill needed to transfer substrate (just load and press button)

Substrate etch or degas in load lock gives a better surface for film adhesion with less etched contamination in the sputter chamber

Cryo pumped and hydrocarbon free vacuum provides a major benefit to film quality and fast pump down compared to turbo/turbodrag pumped chambers

UHV at no extra cost (5 x 10-9 torr) improved film quality and gives lower film contamination levels and faster chamber cleanups after transfer.

GammaSoft™ touch screen control is the world's most advanced control system for sputter tools, providing unrivalled repeatability, processing performance, datalogging, trending and recipe creation in a single package. (request a free demo copy)

Fully Interlocked against operator damage prevents user from causing damage to the tool or themselves by trying to operate tool in unsafe manner

Fully interlocked manual control prevents the tool from being damaged by inexperienced users whilst manual processing

Fully interlocked automatic control lets the user load the recipe, press the button and leave the tool to run up to >1000 sequential layers unattended

Unlimited recipe creation and storage on the computers hard disk drive allows users to maximise tool use without having to purchase extra capability

CMS capable with wedge or gradient growth power ramping provides a specialized routine in software for controlling power ramping functions between 2 cathodes. (Lets you grow single material gradients or super alloy with a constant alloy variation across the substrate)

GMR/TMR/MRAM multi layer structures, software routines for read write head and HDD media storage. 450Oe variable magnetic field is also available

Low temperature resist based process wafer stage option for processing resist coated substrates without the worry of resist decomposition or overheating during high power sputter runs

High temperature annealing and processing chuck options (>1000C) allows extreme temperature processing during growth and post annealing without breaking vacuum. (02 Capable versions for MEMS post PZT dep anneal)

Sputter etch and RF bias on wafer chuck (worktable) gives the user ability to accurately control film properties and argon ion etch rates during film growth

24-7 technical support by technical experts with contact by telephone and email out of office hours (GMT).

CE marked for safety and complies with SEMI S2 guidelines, Low Voltage and machinery directives

Free Software upgrades for first 3 years. Lifetime upgrades are optional. We will also develop special control modules to your specification if requested.

Very fast chamber access lets the operator change sputter targets, shutter blades and shields quickly with minimal disturbance or contamination

Ultra High Purity process gas delivery system helps improve film contamination levels and background gas purity during dry down and processing.

Fully clean room compatible design and installations in clean rooms from class 100 to 100000

Tool spare parts available for a minimum of 10 years from tool purchase so you can be assured of a long trouble free tool life

CEVP Ltd reserves the right to alter any part of this specification without prior notice.